CVE-2018-11269
Severity CVSS v4.0:
Pending analysis
Type:
Unavailable / Other
Publication date:
20/09/2018
Last modified:
23/11/2018
Description
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
Impact
Base Score 3.x
7.80
Severity 3.x
HIGH
Base Score 2.0
7.20
Severity 2.0
HIGH
Vulnerable products and versions
| CPE | From | Up to |
|---|---|---|
| cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9635m:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9645:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9655:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page



