CVE-2019-2266

Severity CVSS v4.0:
Pending analysis
Type:
CWE-415 Double Free
Publication date:
21/11/2019
Last modified:
24/08/2020

Description

Possible double free issue in kernel while handling the camera sensor and its sub modules power sequence in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8053, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, Nicobar, QCA9980, QCS405, QCS605, SDM845, SDX24, SM7150, SM8150

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8053:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:ipq4019:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ipq8064_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:ipq8064:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9207c:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:msm8909:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*