CVE-2019-2266
Severity CVSS v4.0:
Pending analysis
Type:
CWE-415
Double Free
Publication date:
21/11/2019
Last modified:
24/08/2020
Description
Possible double free issue in kernel while handling the camera sensor and its sub modules power sequence in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8053, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, Nicobar, QCA9980, QCS405, QCS605, SDM845, SDX24, SM7150, SM8150
Impact
Base Score 3.x
7.80
Severity 3.x
HIGH
Base Score 2.0
4.60
Severity 2.0
MEDIUM
Vulnerable products and versions
| CPE | From | Up to |
|---|---|---|
| cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8053:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:ipq4019:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:ipq8064_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:ipq8064:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9207c:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:msm8909_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:msm8909:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page



