CVE-2020-11239
Severity CVSS v4.0:
Pending analysis
Type:
CWE-416
Use After Free
Publication date:
09/06/2021
Last modified:
15/06/2021
Description
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Impact
Base Score 3.x
7.80
Severity 3.x
HIGH
Base Score 2.0
7.20
Severity 2.0
HIGH
Vulnerable products and versions
| CPE | From | Up to |
|---|---|---|
| cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8009:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:apq8009w_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8009w:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8017:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:apq8037_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8037:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8053:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:apq8064au_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8064au:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:apq8076_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8076:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page



