Instituto Nacional de ciberseguridad. Sección Incibe
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CVE-2022-22081

Severity CVSS v4.0:
Pending analysis
Type:
CWE-190 Integer Overflow or Wraparound
Publication date:
16/09/2022
Last modified:
08/08/2023

Description

Memory corruption in audio module due to integer overflow in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables

Impact

Vector 3.x
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H CVSS v3.1 Severity and Metrics:

Base Score: 7.80 HIGH
Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Attack Vector (AV): Local
Attack Complexity (AC): Low
Privileges Required (PR): Low
User Interaction (UI): None
Scope (S): Unchanged
Confidentiality (C): High
Integrity (I): High
Availability (A): High

Base Score 3.x
7.80
Severity 3.x
HIGH

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca6595au:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca8081:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca8337:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sa6155p:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sa8155p:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sa8195p:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*

To consult the complete list of CPE names with products and versions, see this page


References to Advisories, Solutions, and Tools