CVE-2017-18279

Severity CVSS v4.0:
Pending analysis
Type:
CWE-190 Integer Overflow or Wraparound
Publication date:
06/05/2019
Last modified:
16/04/2021

Description

Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016.

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:fsm9055_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:fsm9055:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fsm9955_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:fsm9955:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:ipq4019:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*


References to Advisories, Solutions, and Tools