Instituto Nacional de ciberseguridad. Sección Incibe
Instituto Nacional de Ciberseguridad. Sección INCIBE-CERT

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CVE-2017-18297

Severity CVSS v4.0:
Pending analysis
Type:
CWE-415 Double Free
Publication date:
23/10/2018
Last modified:
07/12/2018

Description

Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.

Impact

Vector 3.x
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H CVSS v3.1 Severity and Metrics:

Base Score: 7.80 HIGH
Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Attack Vector (AV): Local
Attack Complexity (AC): Low
Privileges Required (PR): Low
User Interaction (UI): None
Scope (S): Unchanged
Confidentiality (C): High
Integrity (I): High
Availability (A): High

Base Score 3.x
7.80
Severity 3.x
HIGH
Vector 2.0
AV:L/AC:L/Au:N/C:C/I:C/A:C CVSS v2.0 Severity and Metrics:

Base Score: 7.20 HIGH
Vector: AV:L/AC:L/Au:N/C:C/I:C/A:C

Attack Vector (AV): Local
Attack Complexity (AC): Low
Authentication (Au): None
Confidentiality (C): Complete
Integrity (I): Complete
Availability (A): Complete

Base Score 2.0
7.20
Severity 2.0
HIGH

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*

To consult the complete list of CPE names with products and versions, see this page


References to Advisories, Solutions, and Tools