CVE-2018-11258
Severity CVSS v4.0:
Pending analysis
Type:
CWE-416
Use After Free
Publication date:
06/07/2018
Last modified:
06/09/2018
Description
In ADSP RPC in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, a Use After Free condition can occur in versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Impact
Base Score 3.x
7.80
Severity 3.x
HIGH
Base Score 2.0
4.60
Severity 2.0
MEDIUM
Vulnerable products and versions
| CPE | From | Up to |
|---|---|---|
| cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page



