CVE-2018-11865

Severity CVSS v4.0:
Pending analysis
Type:
CWE-190 Integer Overflow or Wraparound
Publication date:
29/10/2018
Last modified:
07/12/2018

Description

Integer overflow may happen when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*


References to Advisories, Solutions, and Tools