CVE-2018-11866
Severity CVSS v4.0:
Pending analysis
Type:
CWE-190
Integer Overflow or Wraparound
Publication date:
29/10/2018
Last modified:
07/12/2018
Description
Integer overflow may happen in WLAN when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version IPQ8074, MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.
Impact
Base Score 3.x
7.80
Severity 3.x
HIGH
Base Score 2.0
7.20
Severity 2.0
HIGH
Vulnerable products and versions
| CPE | From | Up to |
|---|---|---|
| cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:ipq8074:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page



