CVE-2019-14037
Severity CVSS v4.0:
Pending analysis
Type:
CWE-416
Use After Free
Publication date:
30/07/2020
Last modified:
31/07/2020
Description
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
Impact
Base Score 3.x
7.80
Severity 3.x
HIGH
Base Score 2.0
4.60
Severity 2.0
MEDIUM
Vulnerable products and versions
| CPE | From | Up to |
|---|---|---|
| cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8009:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8053:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8096au:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8098:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9207c:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page



