CVE-2019-14085

Severity CVSS v4.0:
Pending analysis
Type:
CWE-191 Integer Underflow (Wrap or Wraparound)
Publication date:
05/03/2020
Last modified:
06/03/2020

Description

Possible Integer underflow in WLAN function due to lack of check of data received from user side in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCN7605, QCS605, SDA845, SDM670, SDM710, SDM845, SDM850, SM8150, SXR1130

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qcn7605:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sda845:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sdm670:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sdm710:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sdm845:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sdm850:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*