CVE-2020-11255

Severity CVSS v4.0:
Pending analysis
Type:
Unavailable / Other
Publication date:
07/04/2021
Last modified:
12/04/2021

Description

Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8009:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8017:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8037_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8037:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8053:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:aqt1000:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csrb31024_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:csrb31024:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm8207_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm8207:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*