CVE-2021-30350

Severity CVSS v4.0:
Pending analysis
Type:
Unavailable / Other
Publication date:
14/06/2022
Last modified:
08/08/2023

Description

Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:aqt1000:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csrb31024_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:csrb31024:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca6390:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca6391:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6420_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca6420:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca6426:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6430_firmware:-:*:*:*:*:*:*:*