CVE-2018-11264
Severity CVSS v4.0:
Pending analysis
Type:
CWE-119
Buffer Errors
Publication date:
28/11/2018
Last modified:
26/12/2018
Description
Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.
Impact
Base Score 3.x
7.80
Severity 3.x
HIGH
Base Score 2.0
7.20
Severity 2.0
HIGH
Vulnerable products and versions
| CPE | From | Up to |
|---|---|---|
| cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page



