CVE-2018-11277
Severity CVSS v4.0:
Pending analysis
Type:
Unavailable / Other
Publication date:
20/09/2018
Last modified:
03/10/2019
Description
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Impact
Base Score 3.x
7.80
Severity 3.x
HIGH
Base Score 2.0
4.60
Severity 2.0
MEDIUM
Vulnerable products and versions
CPE | From | Up to |
---|---|---|
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:sd210:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:sd212:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:sd205:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:sd430:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:sd450:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sd615_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page