CVE-2018-13898
Severity CVSS v4.0:
Pending analysis
Type:
CWE-787
Out-of-bounds Write
Publication date:
14/06/2019
Last modified:
18/06/2019
Description
Out-of-Bounds write due to incorrect array index check in PMIC in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130
Impact
Base Score 3.x
9.80
Severity 3.x
CRITICAL
Base Score 2.0
7.50
Severity 2.0
HIGH
Vulnerable products and versions
| CPE | From | Up to |
|---|---|---|
| cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9150:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9655:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:qcs405:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:qualcomm_215_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page



