CVE-2019-10612
Severity CVSS v4.0:
Pending analysis
Type:
CWE-787
Out-of-bounds Write
Publication date:
05/03/2020
Last modified:
09/03/2020
Description
UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Impact
Base Score 3.x
9.80
Severity 3.x
CRITICAL
Base Score 2.0
10.00
Severity 2.0
HIGH
Vulnerable products and versions
| CPE | From | Up to |
|---|---|---|
| cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9205:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sa6155p:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sc8180x:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sda845:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:sdm670:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page



