CVE-2019-10612

Severity CVSS v4.0:
Pending analysis
Type:
CWE-787 Out-of-bounds Write
Publication date:
05/03/2020
Last modified:
09/03/2020

Description

UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9205:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sa6155p:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sc8180x:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sda845:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sdm670:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*