CVE-2020-11133

Severity CVSS v4.0:
Pending analysis
Type:
CWE-120 Buffer Copy without Checking Size of Input ('Classic Buffer Overflow')
Publication date:
08/09/2020
Last modified:
14/09/2020

Description

u'Possible out of bound array write in rxdco cal utility due to lack of array bound check' in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MSM8998, QCS605, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SXR1130

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:msm8998:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sda845:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sdm636:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sdm670:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*