CVE-2020-11133
Severity CVSS v4.0:
Pending analysis
Type:
CWE-120
Buffer Copy without Checking Size of Input ('Classic Buffer Overflow')
Publication date:
08/09/2020
Last modified:
14/09/2020
Description
u'Possible out of bound array write in rxdco cal utility due to lack of array bound check' in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MSM8998, QCS605, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SXR1130
Impact
Base Score 3.x
7.80
Severity 3.x
HIGH
Base Score 2.0
4.60
Severity 2.0
MEDIUM
Vulnerable products and versions
CPE | From | Up to |
---|---|---|
cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:msm8998:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:sda845:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:sdm636:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:* | ||
cpe:2.3:h:qualcomm:sdm670:-:*:*:*:*:*:*:* | ||
cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page