CVE-2020-11202

Severity CVSS v4.0:
Pending analysis
Type:
CWE-787 Out-of-bounds Write
Publication date:
12/11/2020
Last modified:
22/12/2021

Description

Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:qcm6125_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qcm6125:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qcs410:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs603_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qcs603:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qcs610:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs6125_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qcs6125:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sa6145p:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*