CVE-2021-30341

Severity CVSS v4.0:
Pending analysis
Type:
CWE-787 Out-of-bounds Write
Publication date:
14/06/2022
Last modified:
19/04/2023

Description

Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:apq8009w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8009w:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8096au:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:aqt1000:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csrb31024_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:csrb31024:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm8207_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm8207:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9205:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*