CVE-2021-30341
Severity CVSS v4.0:
Pending analysis
Type:
CWE-787
Out-of-bounds Write
Publication date:
14/06/2022
Last modified:
19/04/2023
Description
Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Impact
Base Score 3.x
9.80
Severity 3.x
CRITICAL
Base Score 2.0
10.00
Severity 2.0
HIGH
Vulnerable products and versions
| CPE | From | Up to |
|---|---|---|
| cpe:2.3:o:qualcomm:apq8009w_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8009w:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:apq8096au:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:aqt1000:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:csrb31024_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:csrb31024:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm8207_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm8207:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:* | ||
| cpe:2.3:h:qualcomm:mdm9205:-:*:*:*:*:*:*:* | ||
| cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* |
To consult the complete list of CPE names with products and versions, see this page



