Instituto Nacional de ciberseguridad. Sección Incibe
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CVE-2022-25656

Severity CVSS v4.0:
Pending analysis
Type:
CWE-190 Integer Overflow or Wraparound
Publication date:
16/09/2022
Last modified:
19/04/2023

Description

Possible integer overflow and memory corruption due to improper validation of buffer size sent to write to console when computing the payload size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

Impact

Vector 3.x
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H CVSS v3.1 Severity and Metrics:

Base Score: 7.80 HIGH
Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Attack Vector (AV): Local
Attack Complexity (AC): Low
Privileges Required (PR): Low
User Interaction (UI): None
Scope (S): Unchanged
Confidentiality (C): High
Integrity (I): High
Availability (A): High

Base Score 3.x
7.80
Severity 3.x
HIGH

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca6174a:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca6390:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca6391:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca6426:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca6436:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:qca6574:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*

To consult the complete list of CPE names with products and versions, see this page


References to Advisories, Solutions, and Tools